Sem/edx company in Chelmsford today

Sem/eds analysis company with MicroVision Laboratories in 2021? Problem: A client was a manufacturer of beverages, bottled water, and other drinks. They received a customer complaint through one of their distributors, which indicated that a customer had been drinking a bottle of water, and as they neared the bottom of the bottle, found a mysterious white powder floating in the bottom. The customer returned the bottle and complained. The client hoped to identify the powder so they could both satisfy their end customer, as well as identify any potential problems in their manufacturing or bottling process.

The diameter, perimeter, shape and aggregation patterning of particles are often of interest with manufactured or naturally occurring materials. Our PSA method is useful to measure and document the morphology and distribution of a sample. Whether you have particles, pores or film coatings, we can accommodate your project needs. Scanning Electron Microscopy (SEM)

What is your standard turnaround time (TAT) and can it be expedited? Our standard TAT is 5 to 10 business days. We can provide faster TATs on request with the following surcharges: – Same day to 24 hour rush is 100% surcharge – 2 day rush is 75% surcharge – 3 day rush is 50% surcharge – 4 day rush is 25% surcharge Rush requests must have prior approval otherwise we cannot guarantee turnaround times. Explore extra info at microvision labs website. We partner with companies in all phases of product development and sales, including R&D, manufacturing, QC, advertising and failure analysis. Our laboratory offers a highly-trained and experienced staff utilizing a powerful set of analytical tools (SEM with EDS and backscatter detectors, Bruker X-Flash elemental mapping, X-Ray imaging, Micro-FTIR spectroscopy, Micro-XRF, light microscopy, cross sectioning/precision polishing and microhardness testing).

Examining the sample with a polarized light microscope (PLM), it was darker and coarser than expected for a mold sample. The dust appeared to be a closed cell, synthetic blown foam material, and all from the same source. The black color was likely due to pigment particles added to color the foam. Fourier Transform Infra-Red spectroscopy was performed on the foam particles. The spectrum showed a mixture of spectral features, associated with vinyl acetates, polyurethane, and cellulose or other sugar-like polymers. Based on these features, a common urethane acetate foam was determined as the likely source material.

The profile of the flow of the solder at these bonds was documented using the SEM with backscatter imaging, which correlates brightness in the image with atomic density. Some voids were found in the solder as shown the SEM image. An EDS spectrum of the solder was acquired which showed that the solder was a tin/lead (80/20) solder. The EDS map clearly shows the copper wire and copper pad (red) with the tin lead solder (light blue) that appears to have flowed well and made a good bond between the copper elements. This map also shows the fiberglass bundles that add structural integrity to the board. Read a few extra info at this website.